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Thermal Compound

Product Code : PH-NDC

The PH-NDC is a superb quality thermal compound for heatsinks. PH-NDC improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. The PH-NDC is a high-purity Nano diamond-like particle paste that helps to ensure maximum heat dissipation for optimized performance and greater system stability.



Excellent Performance
PH-NDC is made of NANO diamond-like particles of hybrid compound, design for using in environment with low thermal resistance. PH-NDC’s Nano diamond-like particles helps dissipate and transfer the heat when compressed.
No Burn-in Time Required
PH-NDC has no burn-in time that is required to reach maximum performance. Formulated to maximize efficiency instantly when applied.
Non-Electrical Conductive TIM
PH-NDC can be applied to any type of Cooler to enhance the thermal conductivity. PH-NDC does not contain any metal or other electrically conductive materials that will harm other components.
Easy to Apply and Remove
PH-NDC can be easily applied and removed. Just one pea-sized amount of the PH-NDC will do. Once the CPU cooler is installed the PH-NDC particles will spread and maximize the contact area.
Long-term stability
The PH-NDC contains a silicon-free compound that provides excellent long-term stability. The silicon-free compound has an effective thermal cycling, and low dry-out features.
Maximum capability of operating temperature
PH-NDC has a maximum capability of an operating temperature of -40°C to 150°C. PH-NDC will provide a stable working status at any extreme temperature and conditions.

Model NO : PH-NDC    
UPC Code : 886523000792    
Thermal Conductivity
4.5 W/m-k
Thermal Resistance
Specific Gravity
2.55 g/cm^3
Operating Temperature
-40°C - 150°C