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Phanteks PH-TC14CS CPU Cooler

    Patented P.A.T.S (Physical Anti-oxidant Thermal Shield)
    Patented C.P.S.C. (Cold Plasma Spraying Coating)
    C-Type Single Tower Radiator
    Five 8mm Copper Heat-pipes
    Two PH-F140 premium fans

    Compatible with LGA1150 (Haswell)

    Other Available Colors:

    User Manuals:
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Phanteks PH-TC14CS, a single tower C-Type thermal radiator design using the latest aerospace technology. By incorporating P.A.T.S and C.P.S.C Technologies to the design, PH-TC14CS enhances thermal conductivity and creates an opportunity for greater overclocking. Combined with two Phanteks PH-F140TS Premium Fans with PWM functionality, max performance or silent operation is attainable.

Greatly increase the cooling performance and reliability while deflecting other thermal radiation from other heat sources, such as the GPU, South Bridge, North Bridge, etc. P.A.T.S, ran at a long period, will display significantly better results in an enclosure, closed environment, than a tech station, open environment. In extreme conditions, PATS is able to withstand temperatures of up to 200 degrees Celcius. P.A.T.S is environmental friendly and non-toxic.
A brand new technologic forming deposit that displaces heat onto corresponding metals at a quicker rate. With this technology, the Phanteks PH-TC14CS enhances thermal conductivity on the soldered surfaces of the heat-pipes through the copper deposits.
Designed with C type Single tower radiator; the PH-TC14CS has fiveψ8mm heat-pipes linearly aligned to ensure optimal cooling. This cooler is made to have the least amount of air and thermal resistance.
Phanteks PH-F140 premium 140mm fans uses Updraft Floating Balance (U.F.B) bearing, nine Maelstrom Vortex Booster (M.V.B) blades, and Maelstrom Air-Fort Optimization (M.A.F.O) drive system to achieve massive airflow and perfect dynamic balance. to reduce noise level, the fan emits a low dBA with the support of the anti-acoustic rubber-pad and rubber-bar to help eliminate vibration.
The SoliSku universal mounting kit provides an easy-to-install rotational backplate for Intel LGA 2011/1155/1156/11366/775. AMD FM1/AM3+/AM3/AM2+/AM2 ( stock backplate required ).
The PH-NDC is a superb quality thermal compound for heatsinks. It is made of high-purity nano diamond like particles to improve the thermal conductance between components. The generated heat caused by the CPU will transfer to the heatsink, without reduction in efficiency and resistance.